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Lecturer(s)
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Říhová Zora, doc. Ing. CSc.
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Vohnoutová Marta, Ing.
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Symonová Radka, doc. Mgr. Ph.D.
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Course content
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The aim of the internship is to use and verify the acquired knowledge and skills in the practical conditions of a particular corporate environment. At the same time, students will test their own ability to solve a range of practical problems in the field of applied informatics. This solution of practical problems as well as understanding the connection with the operation of the company will help anchor theoretical knowledge and clarify specific areas of interest in the field of AI, data sciences and computer systems. Part of the course is an introductory seminar for the presentation of companies, at the end of the internship students will prepare a final report as a condition for granting credit. Internships in individual technology companies are contractually secured.
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Learning activities and teaching methods
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Excursion, Individual tutoring
- Semestral paper
- 10 hours per semester
- Class attendance
- 490 hours per semester
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Learning outcomes
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Practical verification and improvement of knowledge and skills gained during the studies in the environment of applied sector.
Application of theoretical knowledge in the practical environment of IT companies.
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Prerequisites
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Acknowledged organization aspects of the internship with a selected company.
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Assessment methods and criteria
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Student performance assessment, Interim evaluation
To complete the course it is required to obtain the confirmation from the employer about the successful internship completion and present the final report. 10hod: Semester work Additional study materials: Materials for lectures and tutorials will be in USB LMS Moodle.
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Recommended literature
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MARTIN GARY E., ARNOLD B. DANZIG, WILLIAM F. WRIGHT, RICHARD A. FLANARY. School Leader Internship. Routledge; 4 edition 2016, ISBN: 978-1138824010.
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RYAN D GLICK. Internship Mastery: The Technology Student's Guide to Crushing Your Internship and Launching Your Career, Glick Press 2019, ISBN: 978-0578611303.
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