Lecturer(s)
|
-
Straňák Vítězslav, prof. RNDr. Ph.D.
|
Course content
|
I1. Introduction and historical aspects of vaccum 2. Processes in a gas volume 3. Gas interaction with surfaces 4. Measurement of pressure and gas flow, sensors, gauges 5. Vacuum systems 6. Advanced and complex vacuum systems 7. Plasma surface treatment 8. PVD deposition of thin films 9. PECVD deposition of thin films 10. Ion implantation and deposition of nanoparticles 11. Deposition of nanostructured surfaces / materials 12. Plasma deposition and coating in the industry
|
Learning activities and teaching methods
|
Monologic (reading, lecture, briefing), Demonstration, Laboratory
- Class attendance
- 26 hours per semester
- Preparation for classes
- 30 hours per semester
- Preparation for credit
- 10 hours per semester
- Preparation for exam
- 25 hours per semester
|
Learning outcomes
|
The main aim is to introduce modern and advanced plasma technology processes that utilizes aspects and advantages of ionized gases. The interest is focused namely on processes like deposition of thin films, cluster formation, plasma surface modification and their applications into biomedicine, semiconductor industry etc. Necessary topics regarding plasma physics, vacuum technology science, plasma diagnostics, plasma discharges and similar are partially included, too.
Students will learn the technologies of achieving low pressures and with methods of their measurement. At the same time, the students get to know the basics of low-temperature plasma generation and its utilization for the deposition of thin films and nanoparticle fabrication.
|
Prerequisites
|
basic knowledge of plasma physics
|
Assessment methods and criteria
|
Combined exam
Students must pass the final test and oral exam with a minimally 75% of the total amount of points.
|
Recommended literature
|
-
J.R. Roth, Industrial Plasma Engineering: Applications. Institute of Physics Pub (2001).
-
J.R. Roth, Industrial Plasma Engineering: Principles. Institute of Physics Pub (2001).
-
K. Jousten, Handbook of Vacuum Technology, Wiley-Vch (2008).
-
M.A. Lieberman, A.J. Lichtenberg, Principles of plasma discharges and materials processing, J. Wiley, New York (2005).
-
Pátý L.: Vakuová, technika, skriptum, ČVUT, Praha 1990. ČVUT, Praha, 1990.
-
R. Hippler, H. Kersten, M. Schmidt, K. H. Schoenbach: Low Temperature Plasma,: Fundamentals, Technologies and Techniques, Wiley-VCH, (2008).
-
V. Martisovic, Základy fyziky plazmy, Bratislava (2006), 192 s. ISBN 80-223-1983.
|