Course: Plasma and vacuum technology (CS)

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Course title Plasma and vacuum technology (CS)
Course code UFY/PTK
Organizational form of instruction Lecture
Level of course Master
Year of study not specified
Frequency of the course In each academic year, in the winter semester.
Semester Winter
Number of ECTS credits 3
Language of instruction Czech
Status of course unspecified
Form of instruction Face-to-face
Work placements This is not an internship
Recommended optional programme components None
Lecturer(s)
  • Straňák Vítězslav, doc. RNDr. Ph.D.
  • Kratochvíl Jiří, RNDr. Ph.D.
Course content
I1. Introduction and historical aspects of vaccum 2. Processes in a gas volume 3. Gas interaction with surfaces 4. Measurement of pressure and gas flow, sensors, gauges 5. Vacuum systems 6. Advanced and complex vacuum systems 7. Plasma surface treatment 8. PVD deposition of thin films 9. PECVD deposition of thin films 10. Ion implantation and deposition of nanoparticles 11. Deposition of nanostructured surfaces / materials 12. Plasma deposition and coating in the industry

Learning activities and teaching methods
Monologic (reading, lecture, briefing), Demonstration, Laboratory, Practical training
  • Preparation for credit - 10 hours per semester
  • Class attendance - 26 hours per semester
  • Preparation for classes - 10 hours per semester
  • Preparation for exam - 15 hours per semester
Learning outcomes
The main aim is to introduce modern and advanced plasma technology processes that utilizes aspects and advantages of ionized gases. The interest is focused namely on processes like deposition of thin films, cluster formation, plasma surface modification and their applications into biomedicine, semiconductor industry etc. Necessary topics regarding plasma physics, vacuum technology science, plasma diagnostics, plasma discharges and similar are partially included, too.
Students will learn the technologies of achieving low pressures and with methods of their measurement. At the same time, the students get to know the basics of low-temperature plasma generation and its utilization for the deposition of thin films and nanoparticle fabrication.
Prerequisites
basic knowledge of plasma physics
UFY/CV012
----- or -----
UFY/FYZ2

Assessment methods and criteria
Oral examination, Combined exam, Test

Students must pass the final test and oral exam with a minimally 75% of the total amount of points.
Recommended literature
  • J.R. Roth, Industrial Plasma Engineering: Applications. Institute of Physics Pub (2001).
  • J.R. Roth, Industrial Plasma Engineering: Applications. Institute of Physics Pub (2001)..
  • J.R. Roth, Industrial Plasma Engineering: Principles. Institute of Physics Pub (2001).
  • J.R. Roth, Industrial Plasma Engineering: Principles. Institute of Physics Pub (2001)..
  • K. Jousten, Handbook of Vacuum Technology, Wiley-Vch (2008).
  • K. Jousten, Handbook of Vacuum Technology, Wiley-Vch (2008)..
  • M.A. Lieberman, A.J. Lichtenberg, Principles of plasma discharges and materials processing, J. Wiley, New York (2005).
  • M.A. Lieberman, A.J. Lichtenberg, Principles of plasma discharges and materials processing, J. Wiley, New York (2005)..
  • Pátý L.: Vakuová, technika, skriptum, ČVUT, Praha 1990.
  • R. Hippler, H. Kersten, M. Schmidt, K. H. Schoenbach: Low Temperature Plasma,: Fundamentals, Technologies and Techniques, Wiley-VCH, (2008).
  • R. Hippler, H. Kersten, M. Schmidt, K. H. Schoenbach: Low Temperature Plasma,: Fundamentals, Technologies and Techniques, Wiley-VCH, (2008)..
  • V. Martisovic, Základy fyziky plazmy, Bratislava (2006), 192 s. ISBN 80-223-1983.
  • V. Martisovic, Základy fyziky plazmy, Bratislava (2006), 192 s. ISBN 80-223-1983..


Study plans that include the course
Faculty Study plan (Version) Category of Branch/Specialization Recommended year of study Recommended semester